
Global Research &
Innovative Solutions Co. Ltd.
グローバルな(視点による)調査と創造的解決策を提供することにより、
国際理解(友好)と多様性化の促進を図り、平和な世界作りに貢献する。
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Company Policy
In order to contribute to a peaceful world, we promote diversity and international understanding (friendship) and provide a global research and innovative solutions.
We are clusters of people who played a success out into overseas. Therefore, fundamental requirement is promoted diversity of international understanding (friendship).
In the 1980s, Japan semiconductor business was No. 1 in the world electron devices. However, weakened in the 2000s.
The one of the reasons for the collapse of the industry is the lack o the global and diversified mind, not only at managers and also at engineers.
Living in foreign countries, living in domestic, both are quite different to affect human/company cultures. Our international understanding (friendship) and diversity promotion is keenly to be the first importance. Global research and innovative solutions is our core of the work.
Our business focus consists of the following five.
We are engaging Nano technology (NANO), semiconductor technology (SEMI), manufacturing technology (MANU), patent technology (IP), Diversified Global Friend Ship(DGFS).
Process developments and Path findings
At SMIC, conducted DRAM with ALD Al2O3 high aspect ratio capacitor development project and succeeded first in china. The members were around 40 with process integration and process modules of different nations and languages of English, Chinese, Korean and Japanese. Under the condition of un-cooked cross cultural atmosphere with different skilled engineers, succeeded with conducting the problem identification and solution defining through interaction with each organizations with cross-functional and educational minds.
In Chengdu SMIC, leading process integration and process engineer team for development of power IC manufacturing. 0.35UMOS power device Avalanche issue solved with junior engineers and studied IGBT.
Recently, heading 14nm path findings and obtained clear path to finFET. Researched architectures on 14nm, 20nm, 28nm, and HKMG, SMT, Low-k sidewall, Contact after silicide, SAC, SADP, etc.. Achieved finFET Initial process flow and tool set setting with reverse engineering analysis and creative mind. Created finFET patents 100+.
At Fujitsu, developed high voltage device with thick polysilicon as substrate and V groove isolation for NTT. Developed high speed deposition epitaxial process for high voltage device with pancake type reactor.
Developed Si2H6 low temperature epitaxy technology, amorphous poly (Thermal Amorphous Silicon), ClF3 chamber insitu-cleaning technology were invented and developed successfully. These became industry standardized technologies. Reported at IEDM, ECS, etc. Developed brush scrubber technology with an equipment vendor and implemented in manufacturing lines. Solved complicated molecular contamination issues using analytical, logical approaches and reported in a book entitled “Molecular contaminations in ULSI manufacturing. Realize publishing, co. ltd. ”The book is still contributing semiconductor industries. In DRAM process, conducted direct development at manufacturing line for the first time in Fujitsu, succeeded half development period of as previous cases with well communication, and supporting mind.
Wet treatment, Manufacturing technology, Yield improvement technology
For high yield, wet treatment always key process. Successfully co-development spin scrubber with vendors also wet treatment process and tools optimization with modification.
Evaluated and implemented YMS (Yield Management System), DMS (Defect Management System), defect inspection tools to lines and standardized. Conducted and standardized technologies/products transfer to production lines with YMS/DMS data at pilot/development line. This method achieved defect level setting and high yield for early stage of production.
Advanced technology research, Patent strategy/patent creation
At Fujitsu, 100 more patents submission and still alive 19 patents in Japan, 10 patents in US that are useful for the defense even 8 years past from my leaving. At SMIC 300 more patents submission and recent consecutive three years, top in SMIC.
At SMIC, providing research results on leading companies advanced technology node, such as 28nm, 20nm, 14nm, 10nm road map and revealed process steps in point of view from middle/long range development planning. Conducting companywide patent creation activities. Investigating and evaluating on Licenser’s technology by discussion with licenser’s engineers on technical matters.
Technology transfer
At Fujitsu, conducted process technologies transfer projects to US and to China. To US technology transfer concentrated on the technology specifications. To China concentrated on the cultural philosophy difference, for example, “considering with running” and “considering before running” and on training to young Chinese engineers.
At SMIC, supported and trained young Chengdu engineers at Elpida Hiroshima line transfer project. Provided support and advice with information exchange/sharing to related supporting Shanghai staff for efficient work of total 80 engineers. After joined the project, the first equipment could installed within 3 month in Chengdu. In addition, at technology transfer, conducted and located 20 process integration and modules engineers at Hiroshima. The engineer’s skills were different a lot. Gave them strong support to success also acted as a technical translator.
Marketing sales support
At SMIC, information exchange/sharing with marketing sales team based on the technical discussion with (potential) customer’s engineers, such as Toshiba Flash and CIS technical trend, Fujitsu FCRAM technical trend and Nikon imagers. In addition, proposed 0.13um DRAM development and TSES establishment.
Global management, cross-functional and cross-cultural experience
SMIC is biggest foundry in china and CEO was Chinese American. Obtained CEO’s direct instructions for 8 years. The nations are from china, US, Singapore, Korea, Europe and Japan. And, populations are as in the order. Japanese population is very small. Normally operations are in English and Chinese languages. Under the condition, established new joint venture company TSES from planning bases with a Japanese company. Concentrated on making cross-cultural environment and teamwork of around 50 project members at first step. Succeeded establishment of TSES and production start on schedule. TSES make profit with supporting customer’s growth. In addition, managed technology development team of 120 engineers and succeeded highly achievement of objectives. Concentrated hearing voices, discussion and documentation.